Embedded World will run from 14th to 16th March in Nuremberg.
You will find our latest developments - DBM-SoC3 module and HyperMAX board - on Intel Booth, Hall 1.338.
DBM-SoC3 – Arria 10 SoC Module
Arria 10 SoC performance in module form factor is provided by the DBM-SoC3.
Up to 660K LE, two DDR3 memory banks, eMMC flash memory, power supply,
24 transceiver channels and 284 IO pins. This provides full flexibility and short
time to market for your application. First steps can be done with our baseboard.
HyperMAX – Max10 FPGA meets Hyperbus memory
You want to learn more on the HyperMAX Board or on the Hyperbus-IP-Core?
Arrange a date with Benjamin Gittins, CTO of Synaptic Labs. HyperMAX Boards with
25K and 50KLE device are ready to test with the Hyperbus memory devices and the
DB-UBLASTER2 – the compact USB-BLASTER2
You plan to integrate the USB-Blaster II into your system? No problem - the embedded
variant of the DB-UBLASTER2 is available as small add-on module to your system.
Or just use the tool in handy size housing with only 20x11x37mm.
devboards partner Synaptic Labs will be meeting with HyperMAX board users at Embedded World. To learn more at Embedded World about the benefits of the HyperMAX development boards, that are the ONLY Intel FPGA based development boards with HyperRAM and HyperFlash, then please contact Synaptic Labs CTO Benjamin GITTINS to arrange a time to meet at EW. email: firstname.lastname@example.org mobile phone: +356 99449390